• Smiths Interconnect
  • $65,945.00 -127,580.00/year*
  • Tampa, FL
  • Electronics/Semiconductors
  • Full-Time
  • 17952 Holly Brook Dr

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About Us Smiths Group is a global technology company listed on the London Stock Exchange (SMIN.L) with over $4B in annual revenue across five divisions. As a world leader in the practical application of advanced technologies, Smiths Group delivers products and services including airborne SATCOM terminals, threat and contraband detection, medical devices, energy, communications and engineered components to markets worldwide. Our products and services enable the world to communicate better, live healthier and be more productive. Smiths Group employs over 22,000 people in more than 50 countries throughout its five divisions - John Crane, Smiths Medical, Smiths Detection, Smiths Interconnect and Flex-Tek. We have been at the forefront of technology for over 160 years and our products and services continue to touch the lives of millions of people every day. Within Smiths Group, Smiths Interconnect is a leading provider of airborne SATCOM terminals, radars, high power transceivers, microwave subsystems, electronic components, microwave and radio frequency products. These products connect, protect and control critical applications in the commercial aviation, defense, space, wireless telecommunications, and industrial markets. Job Description Position is open to location in Tampa, FL , Thousand Oaks, CA OR Northampton, MA - location preference will be verified if selected to interview. Responsible for all phases of product development from conception through production of RF/Microwave/MMW components (e.g. couplers, power dividers, LNA?s, mixers, PA?s, switches, phase shifters, attenuators, oscillators, antennas, ferrite devices, etc) and subsystems (e.g. transceivers, frequency converters, RADAR front-ends, radiometer front-ends, LO sources, frequency synthesizers, switch matrices, arrays) built up from these components. Responsibilities may include: Bid & Proposal, project management, detailed design, design for manufacture, testing and design production support. A high degree of flexibility is required due to the varying needs of the business, specific needs of the project, and along the project life cycle. Requires a high degree of creative ability, engineering skill, and independent judgment. Duties & Responsibilities Responsibilities: Application of advanced technical concepts, techniques, and procedures to the development of RF/Microwave/MMW products. Identifies and documents and functional requirements Development of RF design and specifications, analysis of alternative designs, subassembly and module design, verification testing, and peer review of RF designs Provide necessary documentation and technical expertise to support bid and proposal efforts including technical writing and costing Contributes to complete major engineering projects or several small projects, including the efforts of Mechanical and Electrical Drafters, Technicians and other Engineering Staff Prepare and provides formal briefings to the Staff and Project Sponsors Lead technical discussions at project review sessions and in negotiations with the Project Sponsor Define and organize proposed projects into the tasks and activities needed to solve the problems being addressed. Schedule work to meet completion dates and technical specifications Regularly provide technical guidance and oversight to Technical Staff Comply with and ensure department compliance with Company health, safety and environmental policies Comply with all applicable U.S. export control and security regulations Manage engineering projects for technical performance, budget, and schedule Other duties as required The Individual Education: Bachelor's degree in Electrical Engineering or related Discipline required Technical Knowledge, Skills and Abilities: Required: Competent in RF linear and non-linear circuit simulation using software such as AWR, Eagleware, or ADS Competent in analog DC, AC, and transient circuit simulation using SPICE or derivative Competent in RF measurements and design validation procedures Experience with 2.5D and 3D electromagnetic problems and simulation tools Self-motivated, reliable, and accountable individual who assumes task ownership Ability to understand and evaluate metrics and apply process improvement measures Ability to work effectively under pressure to meet deadlines Security: ? U.S. Person required (U.S. Citizen or Permanent Resident). Ability to obtain Secret Security Clearance, if needed. Preferred: Knowledgeable of multi-layer printed wiring boards (PWB) design and layout up to 20 GHz Knowledgeable of single-layer duroid and ceramic layout up to 40GHz Knowledgeable of chip & wire/bare die design practices Knowledgeable of system architecture and block diagram planning of up converters and down converters Knowledgeable of frequency planning and mixer spurious analysis for up and down converters Knowledgeable of phase noise requirements, cascaded phase noise performance, and connection to hardware implementation methods General knowledge of the requirements for and design of microwave sources, LNAs, SSPAs, mixers, filters, and synthesizers SSPA design of at least 10W linear from C-band through Ka Band using GaN or GaAs devices
Associated topics: board, chip, h/w designer, hardware designer, hardware engineer, layout, pc, pcb, rf, schema

* The salary listed in the header is an estimate based on salary data for similar jobs in the same area. Salary or compensation data found in the job description is accurate.

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